Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies Login for the JSON version of this page.

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Title: Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
ISBN-10: 0-07-036648-9
ISBN-13: 978-0-07-036648-0
Author(s): John H. Lau
Publisher: McGraw-Hill, McGraw-Hill Professional
Published: 1996
Format: Hardcover
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Pages: 672
Language: Login for language details.
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Description

Metadata

EAN: 9780070366480
ASIN: 0070366489
Prefix: 978
Group: 0
Group Name: English language
Group Identifier: 978-0
Registrant: 07
Publication: 036648
Check Digit: 0
Formatted: 978-0-07-036648-0

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