Chip Scale Package: Design, Materials, Process, Reliability, and Applications

Chip Scale Package: Design, Materials, Process, Reliability, and Applications Login for the JSON version of this page.

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Title: Chip Scale Package: Design, Materials, Process, Reliability, and Applications
ISBN-10: 0-07-038304-9
ISBN-13: 978-0-07-038304-3
Author(s): John H. Lau, Ricky S. Lee, Ricky S.W. Lee
Publisher: McGraw-Hill Professional
Published: 1999
Format: Hardcover
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Pages: 422
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Description

Metadata

EAN: 9780070383043
ASIN: 0070383049
Prefix: 978
Group: 0
Group Name: English language
Group Identifier: 978-0
Registrant: 07
Publication: 038304
Check Digit: 3
Formatted: 978-0-07-038304-3

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