Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices Login for the JSON version of this page.

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Title: Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
ISBN-10: 0-429-86382-9
ISBN-13: 978-0-429-86382-0
Author(s): Ephraim Suhir
Publisher: Taylor & Francis Group
Published: 2020
Format
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Pages: 406
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Description

Metadata

EAN: 9780429863820
ASIN: 0429863829
Prefix: 978
Group: 0
Group Name: English language
Group Identifier: 978-0
Registrant: 429
Publication: 86382
Check Digit: 0
Formatted: 978-0-429-86382-0

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