Materials Processes Integration and Reliability in Advanced Interconnects for Micro And Nanoelectronics

Materials Processes Integration and Reliability in Advanced Interconnects for Micro And Nanoelectronics Login for the JSON version of this page.

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Title: Materials Processes Integration and Reliability in Advanced Interconnects for Micro And Nanoelectronics
ISBN-10: 1-107-40871-7
ISBN-13: 978-1-107-40871-5
Author(s): Do Yeung Yoon, Qinghuang Lin, E. Todd Ryan, Wen Li Wu
Publisher: University of Cambridge ESOL Examinations
Published: 2014
Format
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Pages: 620
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Description

Metadata

EAN: 9781107408715
ASIN: 1107408717
Prefix: 978
Group: 1
Group Name: English language
Group Identifier: 978-1
Registrant: 107
Publication: 40871
Check Digit: 5
Formatted: 978-1-107-40871-5

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