Advanced Manufacturing Process Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology Volume 18 Issue 2

Advanced Manufacturing Process Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology Volume 18 Issue 2 Login for the JSON version of this page.

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Title: Advanced Manufacturing Process Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology Volume 18 Issue 2
ISBN-10: 1-280-54757-X
ISBN-13: 978-1-280-54757-7
Author(s): C. Bailey, J. Liu
Publisher: Emerald Publishing Limited
Published: 2006
Format
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Pages: 289
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Description

Metadata

EAN: 9781280547577
ASIN: 128054757X
Prefix: 978
Group: 1
Group Name: English language
Group Identifier: 978-1
Registrant: 280
Publication: 54757
Check Digit: 7
Formatted: 978-1-280-54757-7

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