Modeling and Simulation for Microelectronic Packaging Assembly
Modeling and Simulation for Microelectronic Packaging Assembly Login for the JSON version of this page.
- Title
- Modeling and Simulation for Microelectronic Packaging Assembly
- ISBN-10
- 1-299-31442-2
- ISBN-13
- 978-1-299-31442-9
- Author(s)
- Sheng Liu, Liu Yong
- Publisher
- Wiley & Sons, Incorporated, John
- Published
- 2011
- Format
- Subtitle
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- Series
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- Imprint
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- Pages
- 700
- Language
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- Subjects
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- Genre
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Description
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Metadata
- EAN
- 9781299314429
- ASIN
- 1299314422
- Prefix
- 978
- Group
- 1
- Group Name
- English language
- Group Identifier
- 978-1
- Registrant
- 299
- Publication
- 31442
- Check Digit
- 9
- Formatted
- 978-1-299-31442-9