Wafer Level Chip Scale Packaging

Wafer Level Chip Scale Packaging Login for the JSON version of this page.

Average: 0.00, 0 Ratings

Title: Wafer Level Chip Scale Packaging
ISBN-10: 1-4939-1557-6
ISBN-13: 978-1-4939-1557-6
Author(s): Shichun Qu, Liu Yong
Publisher: Springer
Published: 2014
Format: paperback
Subtitle: Login for full book details.
Series: Login to see series details.
Imprint: Login for imprint details.
Pages: 984
Language: Login for language details.
Subjects: Login for subjects details.
Genre: Login for genre details.

Description

Metadata

EAN: 9781493915576
ASIN: 1493915576
Prefix: 978
Group: 1
Group Name: English language
Group Identifier: 978-1
Registrant: 4939
Publication: 1557
Check Digit: 6
Formatted: 978-1-4939-1557-6

1 Related Editions

Related Articles from our Blog

How to Convert ISBN-10 to ISBN-13 (and Vice Versa): A Complete Guide

If you’re in the world of books—whether as a publisher, librarian, bookseller, or avid collector—you’ve likely come across the terms ISBN-10 and ISBN-13. Understanding these formats and knowing how to convert between them is essential for maintaining consistency and compatibility in book records. In this post, we’ll cover everything you need to know about ISBN conversions, step by step.

What is an EAN and How Does it Relate to an ISBN?

If you’ve ever purchased a product online or in a store, you’ve likely come across a barcode. Behind these barcodes lies a standardized system that makes modern commerce possible. Two key codes often encountered are the EAN (European Article Number) and ISBN (International Standard Book Number). But what are they, how are they connected, and why are they so crucial? Let’s explore.