Advanced Manufacturing Processes Lead Free Interconnect Materials and Reliability Modelling for Electronics Packaging

Advanced Manufacturing Processes Lead Free Interconnect Materials and Reliability Modelling for Electronics Packaging Login for the JSON version of this page.

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Title: Advanced Manufacturing Processes Lead Free Interconnect Materials and Reliability Modelling for Electronics Packaging
ISBN-10: 1-84663-011-8
ISBN-13: 978-1-84663-011-8
Author(s): C. Bailey, Johan Liu
Publisher: Emerald Publishing Limited
Published: 2006
Format
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Pages: 296
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Description

Metadata

EAN: 9781846630118
ASIN: 1846630118
Prefix: 978
Group: 1
Group Name: English language
Group Identifier: 978-1
Registrant: 84663
Publication: 011
Check Digit: 8
Formatted: 978-1-84663-011-8

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