Multilayer Ceramic Substrate Technology for VLSI Package Multichip Module

Multilayer Ceramic Substrate Technology for VLSI Package Multichip Module Login for the JSON version of this page.

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Title: Multilayer Ceramic Substrate Technology for VLSI Package Multichip Module
ISBN-10: 1-85166-579-X
ISBN-13: 978-1-85166-579-2
Author(s): K. Otsuka
Publisher: Springer
Published: 1899
Format: Hardcover
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Pages: 463
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Description

Metadata

EAN: 9781851665792
ASIN: 185166579X
Prefix: 978
Group: 1
Group Name: English language
Group Identifier: 978-1
Registrant: 85166
Publication: 579
Check Digit: 2
Formatted: 978-1-85166-579-2

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