Plastic-encapsulated microelectronics

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The past twenty years have seen many important advances in plastic encapsulated microelectronics (PEM) technology. Thanks to new packaging materials, improved design, increased reliability testing,...

Principles of Inorganic Materials Design

By John N. Lalena, David A. Cleary

IC Component Sockets

By Weifeng Liu, Michael Pecht

Parts Selection and Management

By Michael Pecht

Soldering processes and equipment

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Quality conformance and qualification of microelectronic packages and interconnects

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All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shift...

Integrated Circuit Hybrid and Multichip Module Package Design Guidelines

By Michael Pecht

Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential...

Electronic Packaging Reliability

By Luu T. Nguyen

China s Electronics Industry

By Michael Pecht

Encapsulation technologies for electronic applications

By Haleh Ardebili

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity enviro...