P. Muralt Books

Materials, Integration And Packaging Issues For High-Frequency Devices: Volume 783
Materials, Integration And Packaging Issues For High-Frequency Devices: Volume 783

By Hoffmann., J. P., C. A, P, M., Y. S., Maria., KLEE, Randall, Cho, Ch, P. Muralt, Muralt

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Low-temperature Co-fired Ceramics Microwave Dielectrics -- Low Sintering Temperature Of Cuo-fluxed Ag(nb,ta)o[subscript 3] Dielectric Ceramics / Chiping Wang, Thomas Shrout, Gaiying Yang, Hyo-tae K...

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Materials, Integration And Packaging Issues For High-Frequency Devices

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