Shichun Books

Wafer-Level Chip-Scale Packaging: Analog And Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging: Analog And Power Semiconductor Applications

By Ł̈ĨƯ♭̄, Yong, Shichun Qu, Qu, Liu, Yong, Shichun, Shichun Qu, Yong Liu (Auth.)

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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advance...

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