D. I. Basiulis Books
Polymeric Materials For Electronics Packaging And Interconnection
By James L Hedrick, I. Kim, P.J. Brown, B. D. Silverman, James E Anderson, Anne K. St. Clair, Yūji Shirai, David Conroy, C. P. Wong, Robert S. Moore, Stephen D. Senturia, L.M. Baker, Takashi Miwa, Kanji Ōtsuka, John H. Lupinski, Curtis W. Frank, Eric D. Wachsman, H Long, David S. Soane, Paul C. Painter, P. H. Townsend, F. M. Houlihan, C. Feger, JEFF W. LABADIE, R. D. SMALL, Philip R. Troyk, Peter S. Martin, Randy W. Snyder, Coralie A. Pryde, Allyson J. Beuhler, Neal R. Nowicki, Joanne M. Gaudette, A. R. Rossi, Diane M. Stoakley, D. L. Goff, E. L. Yuan, Herbert J. Neuhaus, B. J. Bachman, C. W. Wilkins, J. L. Markham, P. P. Policastro, P. K. Hernandez, Stephen L. Buchwalter, J. McHardy, D. I. Basiulis, G. Angsten, L. R. Higley, R. N. Leyden, S. F. Hahn, D. C. Burdeaux, J. A. Gilpin, Gust J. Kookootsedes, Hisashi Ishida, Yasuyuki Utsumi, Justin C. Bolger, Michael A. Lutz, Kristen A. Scheibert, D. J. Belton, E. A. Sullivan, M. J. Molter, D. A. Hoffmann, L. J. Bousse, V. Markovac, W. F. Van Den Bogert, S. A. Gee, V. R. Akylas, Rolf W. Biernath, A. A. Gal
Polymers play an increasingly important role in the construction of integrated circuitry and many electronic devices. This new volume provides an overview of this important topic with an emphasis...
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