P. H. Townsend Books
Polymeric Materials For Electronics Packaging And Interconnection
By James L Hedrick, I. Kim, P.J. Brown, B. D. Silverman, James E Anderson, Anne K. St. Clair, Yūji Shirai, David Conroy, C. P. Wong, Robert S. Moore, Stephen D. Senturia, L.M. Baker, Takashi Miwa, Kanji Ōtsuka, John H. Lupinski, Curtis W. Frank, Eric D. Wachsman, H Long, David S. Soane, Paul C. Painter, P. H. Townsend, F. M. Houlihan, C. Feger, JEFF W. LABADIE, R. D. SMALL, Philip R. Troyk, Peter S. Martin, Randy W. Snyder, Coralie A. Pryde, Allyson J. Beuhler, Neal R. Nowicki, Joanne M. Gaudette, A. R. Rossi, Diane M. Stoakley, D. L. Goff, E. L. Yuan, Herbert J. Neuhaus, B. J. Bachman, C. W. Wilkins, J. L. Markham, P. P. Policastro, P. K. Hernandez, Stephen L. Buchwalter, J. McHardy, D. I. Basiulis, G. Angsten, L. R. Higley, R. N. Leyden, S. F. Hahn, D. C. Burdeaux, J. A. Gilpin, Gust J. Kookootsedes, Hisashi Ishida, Yasuyuki Utsumi, Justin C. Bolger, Michael A. Lutz, Kristen A. Scheibert, D. J. Belton, E. A. Sullivan, M. J. Molter, D. A. Hoffmann, L. J. Bousse, V. Markovac, W. F. Van Den Bogert, S. A. Gee, V. R. Akylas, Rolf W. Biernath, A. A. Gal
Polymers play an increasingly important role in the construction of integrated circuitry and many electronic devices. This new volume provides an overview of this important topic with an emphasis...
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Thin Films: Stresses And Mechanical Properties IV Symposium Held April 12-16, 1993, San Francisco, California, U.S.A.
By T. P. Weihs, J. E. Sanchez, P. H. Townsend, P. Borgesen, Paul H. Townsend, Materials Research Society Spring Meeting (1993 : San Francisco, Calif)
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
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